The Indian Space Research Organisation (ISRO) has announced the launch of its earth observation satellite, EOS-08, scheduled for August 16, 2024. This mission marks the third and final developmental flight of the Small Satellite Launch Vehicle (SSLV)-D3, originally planned for August 15 but delayed without specific reasons.

Mission Objectives and Industry Collaboration

The launch, set to take place from the Satish Dhawan Space Centre in Sriharikota, represents a crucial step in finalizing SSLV's development, paving the way for its future operational use in collaboration with Indian industry and NewSpace India Limited (NSIL). The launch window opens at 09:17 IST, with a one-hour window for the mission.

EOS-08 Satellite Specifications

EOS-08, built on the Microsat/IMS-1 bus, weighs approximately 175.5 kg and has a mission duration of one year. The satellite will be powered by the SSLV-D3/IBL-358 launch vehicle and equipped with three advanced payloads: the Electro-Optical Infrared (EOIR) payload, the Global Navigation Satellite System-Reflectometry (GNSS-R) payload, and a Silicon Carbide (SiC) UV Dosimeter.

EOIR Payload Capabilities

The EOIR payload is designed to capture images in the Mid-Wave Infrared (MIR) and Long-Wave Infrared (LWIR) spectrums, both day and night. This will support satellite-based surveillance, disaster and environmental monitoring, fire detection, and industrial disaster assessment.

GNSS-R Payload Applications

The GNSS-R payload aims to demonstrate GNSS-Reflectometry for remote sensing applications, such as ocean surface wind analysis, soil moisture assessment, cryosphere studies in the Himalayas, and flood detection.

SiC UV Dosimeter for Safety Monitoring

Additionally, the SiC UV Dosimeter will monitor UV irradiance for the Gaganyaan Mission's Crew Module and serve as a high-dose alarm sensor for gamma radiation, enhancing safety measures in space missions.

Advancements in Satellite Technology

According to ISRO, EOS-08 signifies a significant advancement in satellite mainframe systems, particularly with the introduction of an Integrated Avionics system. This system, known as the Communication, Baseband, Storage, and Positioning (CBSP) Package, integrates multiple functions into a single unit using commercial off-the-shelf (COTS) components. It offers up to 400 GB of data storage and includes advanced technologies, such as a structural panel embedded with PCB, a Micro-DGA (Dual Gimbal Antenna), an M-PAA (Phased Array Antenna), and a flexible solar panel, all critical for onboard technology demonstration.